| Chip scale package (CSP): design, materials, processes, reliability, and applications | |
|---|---|
|
John H. Lau, Shi-Wei Ricky Lee. |
|
| Pernyataan Tanggungjawab | |
| Pengarang | Lau, John H. - Personal Name Lee, Shi-Wei Ricky. - Personal Name |
| Edisi | |
| No. Panggil | 621.319 LAU c |
| ISBN/ISSN | 0071165088 |
| Subyek | Integrated circuits Microelectronic packaging |
| Klasifikasi | 621.31924 |
| Judul Seri | |
| GMD | Buku TE |
| Bahasa | English |
| Penerbit | McGraw-Hill |
| Tahun Terbit | c1999 |
| Tempat Terbit | nyu |
| Deskripsi Fisik | xxii, 564 p. : ill. ; 24 cm. |
| Info Detil Spesifik | |
| Lampiran Berkas | LOADING LIST... |
| Ketersediaan | LOADING LIST... |
